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ICSJ 2024 Call for Papers

13th IEEE CPMT Symposium Japan (ICSJ2024)

“Innovation of Packaging Technology for Advanced Heterogeneous Integration” 

November 13 -15, 2024,

Ritsumeikan University Suzaku Campus, Kyoto, JAPAN

https://www.ieee-csj.org/

 

“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. ICSJ provides a platform for you to communicate and interact with global leaders in packaging technology. ICSJ2024 is only on-site conference.

Innovation of Packaging Technology for Advanced Heterogeneous Integration: Semiconductor devices have contributed to the development of various fields including PCs, because the pursuit of miniaturization (More Moore) has made it possible to simultaneously meet the demands for high speed, lower power consumption, and lower cost. 

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