Call for Abstracts: 22nd European Microelectronics and Packaging Conference & Exhibition

EMPC in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will compromise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue.