We invite you to have your article peer-reviewed and published in the new Electronics Packaging section within IEEE Access. This is an exciting opportunity for your research to benefit from the high visibility of IEEE Access.  Your work will also be exposed to 5 million unique monthly users of the IEEE Xplore® Digital Library.

The Electronics Packaging Section within IEEE Access will draw on the expert technical community to continue IEEE’s commitment to publishing the most highly-cited content. The Journal peer-review process targets a publication period of 6 weeks for most acceptecd papers. This journal is fully open and compliant with funder mandates, including Plan S.


The IEEE Electronics Packaging Society section in IEEE Access covers the scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, selection, modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this scope.

Scan the papers in the Electronics Packaging Society Section of IEEE Access. A number of important results are now in our free access program.  Please FOLLOW THIS LINK.


Get Published in the Electronics Packaging Society Section of IEEE Access

Submit a Paper

Select the Electronics Packaging Society (EPS) Section from the pull-down menu of “Manuscript type” in the first page of the submission process.

Author Information and Instructions

EPS is committed to supporting authors and researchers with IEEE Author Tools including the IEEE Publication Recommender, IEEE Graphics Analyzer, LaTeX Analyzer and more. Discover the tools available at the IEEE Author Center.    

The EPS is regarded as a trusted and unbiased source of technical information for dialog and collaboration to advance technology within the computing community. EPS is led by researchers and technology professionals who are at the center of respected electronics packaging communities where readers and authors already come together.

The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations. Each published article is reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Article Processing Charge (APC): US$1,995

IEEE Members receive a 5% discount.

IEEE Society Members receive a 15% discount.

These discounts cannot be combined.

Topical Editors

Ravi Mahajan, Intel Corporation, USA

Wendem Beyene, Meta, USA

Muhannad Bakir, Georgia Institute of Technology, USA

Koneru Ramakrishna, Private Consultant, USA

Hsien-Chie Cheng, Feng Chia University, Taiwan

Yogendra Joshi, Georgia Institute of Technology, USA

Additional Information


Submit a Paper

IEEE Author Tools

READ: "How to Write for Technical Periodicals & Conferences"


IEEE Transactions on Components, Packaging and Manufacturing Technology 

The IEEE Transactions on Components, Packaging and Manufacturing Technology includes a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.  The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of papers must be both new and significant.

Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into the IEEE Author Portal, select "Letters" as paper type.

Template Selector

Be a Reviewer for T-CPMT

Contribute to the research in your field by becoming an IEEE peer reviewer. Peer reviewers fulfill a vital role in the publishing process by giving detailed and professional commentary.

Submission Form

Reviewer Guidelines

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