READ: "How to Write for Technical Periodicals & Conferences"

IEEE Transactions on Components, Packaging and Manufacturing Technology 

The IEEE Transactions on Components, Packaging and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal. The standard paper length is 8 pages. A mandatory Overlength Page Charge of $175 per page (beginning with page 9 and beyond) is required for papers in excess of eight printed pages.

The Transactions includes a Letters section within the publication. Papers will be a maximum of 4 pages. The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of all papers must be both new and significant.

Letters Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into the IEEE Author Portal, select "Letters" as paper type.

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Contribute to the research in your field by becoming an IEEE peer reviewer. Peer reviewers fulfill a vital role in the publishing process by giving detailed and professional commentary.

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T-CPMT Podcasts

A Critical Review of Lithography Methodologies and Impacts of Topography

Signal and Power Integrity Analysis Breakding the Mold Beyond SPICE

          Submit a Paper                          View Current and Past Issue Table of Contents               View top accessed articles

Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems.  Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal. 

Frequency

Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

Note:  Subcribers to the  Transactions on CPMT have online access to all EPS predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.

Recipients of the Best IEEE T-CPMT Associate Editor Award

2023

Karlheinz Bock
Xuejun Fan
Patrick Fay

Luu Nguyen
Suresh Sitaraman

2022

Xiaoxiong  Gu
Yogendra K Joshi
Lavanya Aryasomayajula

2021

Wendem Beyene
Abhijit Chandra
Cemal Basaran

Xiaobing Luo
Chuan Seng Tan
Paragkumar Thadesar

2020

Sushil Bhavnani
Stefano Grivet-Talocia
Lih-Tyng Hwang
Chin Lee
Frank Shi
Markondeya Pulugurtha

2019

Hsien-Chie Cheng
Wen-Yan Yin
Tzong-Lin Wu
John McBride
John Shea
Bing Dang

Submit article/news 

The EPS Newsletter contains information on various Society activities, including conference announcements and post conference reports; and news on publications, awards and chapter activities.  The Newsletter is typically sent to all EPS members twice a year (Winter and Summer) in print.

In between dissemination of the Newletter, members may receive EPS eNotices -- e-mails containing collections of conference/workshop announcements and calls for papers, as well as important Society news.

View Past Issues

READ: "How to Write for Technical Periodicals & Conferences"

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems.  Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal. 

Submit a paper

All papers for the Transactions on CPMT must be submitted for peer-review through SCHOLARONE Manuscripts online review site. 

• This Publication is a Hybrid journal, allowing both traditional manuscript submission and Open Access (author-pays OA) manuscript submission at the discounted rate of $2,495 per article. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs.
• The OA option will be offered to the author at the time the manuscript is submitted. If selected, the OA fee must be paid before the article is published in the journal. If you have unusual circumstances about this, please contact the Editor-in-Chief. 
• The traditional option, if selected, enables access to all qualified subscribers and purchasers via IEEE Xplore. No OA payment is required. 
• The IEEE peer review standard of excellence is applied consistently to all submissions. All accepted articles will be included in the print issue mailed to subscribers. The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual (https://pspb.ieee.org/images/files/files/opsmanual.pdf). Each published article is reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Content

The technical content of papers should be both new and significant. Experimental data should be complete and should include sufficient descriptions of experimental apparatus, methods, and relevant experimental conditions. References should be thorough and complete.

Papers Presented at Conferences

Papers previously or planned to be presented at/published by conferences will be considered for publication under the following conditions.

• The author must disclose information on conference presentation when the paper is submitted for review.

• The author must significant additions/modification to the paper. This could include: new data and detailed analysis of the experimental results; addition of references to the previous work of others (not previous work by the authors); a discussion of the previous work and how the author’s work expands or builds on the previous work: a discussion of how the author’s results compare/contrast the previous work; etc.

• The author must include a reference the previously published paper in the reference section.
• The author should modify the title to reflect the fact that  the paper has been “significantly” modified.
• A description of the modifications must be provided at the time of submission (either in the Author’s cover letter, or in a file uploaded with the manuscript.

Resources for Authors       

EPS Vice President, Publications:  Ravi Mahajan 

EPS publications advance theory and practice within the key technology areas of components, packaging and manufacturing technology.  Whether through the peer-reviewed papers in the IEEE Transactions on Components, Packaging and Manufacturing Technology, as well as other technically-related IEEE Transactions available to EPS Members, or through high-quality papers in the many conference proceedings sponsored through EPS -- readers have access to the information they need to stay current and excel in today's fast-moving technical world. All of this material is avaiable to EPS members through the new Digital Library.

Transactions

All EPS members receive on-line access to the IEEE Transactions on Components, Packaging and Manufacturing Technology as part of their membership -- not additional cost.  Print copies are available for an additional fee.

Letters: The IEEE Transactions on Components, Packaging and Manufacturing Technology now includes a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.  The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community. 

The technical content of papers must be both new and significant. 

Manuscript Length: The standard length for an accepted Letters manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into the IEEE Author Portal, select "Letters" as paper type.

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Most Popular Articles in T-CPMT

 The following Transactions are also available to EPS members at discounted member rates:

• IEEE Transactions on Semiconductor Manufacturing
• IEEE Journal on Miniaturization for Air and Space Systems
• IEEE Sensors Letters
• IEEE Transactions on Games
• IEEE Transactions on Molecular, Biological, and Multi-Scale Communications
• IEEE Transactions on NanoBioscience
• IEEE Journal on Photovoltaics
• IEEE Internet of Things Journal
• IEEE Transactions on Big Data 

Please note: The IEEE/OSA Journal of Display Technology has ceased publication as of it's October-December 2016 issue. The archival content continues to be accessible to readers on the IEEE Xplore platform

Newsletter

The EPS Newsletter contains information on various Society activities, including conference announcements and post conference reports; and news on publications, awards and chapter activities.  The Newsletter is sent to all EPS Members monthly via e-mail and twice a year in digital format.

Conference Proceedings

EPS Members can access papers from Conference Proceedings in the IEEE Xplore® digital library. The full portfolio of proceedings from EPS sponsored conferences is available to all EPS members at no additional cost, through the new EPS Member Digital Library!