READ: "How to Write for Technical Periodicals & Conferences"

 

IEEE Transactions on Components, Packaging and Manufacturing Technology 

NEW: The IEEE Transactions on Components, Packaging and Manufacturing Technology will now include a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.  The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of papers must be both new and significant.

Manuscript Length: The standard length for an accepted manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into ScholarOne, select "Letters" as paper type.

Template for Letters in Transactions

 

          Submit a Paper                          View Current and Past Issue Table of Contents               View top accessed articles

                                                              

  

 The Transactions on Components, Packaging and Manufacturing Technology, first published in January 2011,  is a merger of three CPMT Transactions: the Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies and Transactions on Electronics Packaging Manufacturing.  Read more....

Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Frequency

Published on-line in IEEE Xplore monthly and combine two months of online content into the print edition for six print issues per year.

Subscription Rates (in USD)

Online          Print           
Combo
(Online/Print)
EPS Member included in membership $25 n/a
EPS Student Member included in membership $13 n/a
IEEE Member $45 $50 $60
Non-Member $1345 $1545 $1930

Note:  Subcribers to the  Transactions on CPMT have online access to all EPS predecessor journals (including the most recent Transactions on Advanced Packaging, Transactions on Components and Packaging Technologies, and Transactions on Electronics Packaging Manufacturing) -- going back to 1954.

 

Managing Editor

Ravi Mahajan

Intel 

Advanced Packaging  

Chandler, AZ  USA

phone: +1 480 554 371

 

Senior Area Editor - Advanced Packaging Technologies

Kuo-Ning Chiang
National Tsing Hua University 
Department of Power Mechanical Engineering 
Hsinchu,  Taiwan 
phone: 886 3 5742925

Senior Area Editor - Special Topics

Ravi Mahajan

Intel 

Advanced Packaging  

Chandler, AZ  USA

phone: +1 480 554 371

 

Senior Area Editor Components: Characterization and Modeling

Koneru Ramakrishna

Cirrus Logic, Inc.

Assembly & Packaging Engineering
Austin, TX   USA 
phone: 512-851-4484

 

Senior Area Editor - Electrical Performance of Integrated Systems

Dale Becker
IBM
Systems
Poughkeepsie, NY  USA
phone: +1 845 435-6735

Senior Area Editor - Electronics Manufacturing

School of Elec. and Comp. Eng.
Georgia Tech
Atlanta, GA USA
phone: +1 404 385 6276

Recipients of the 2019 Best IEEE T-CPMT Associate Editor Award

Hsien-Chie Cheng
Wen-Yan Yin
Tzong-Lin Wu
John McBride
John Shea
Bing Dang

READ: "How to Write for Technical Periodicals & Conferences"

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Submit a paper

All papers for the Transactions on CPMT must be submitted for peer-review through SCHOLARONE Manuscripts online review site. 

  • This Publication is a Hybrid journal, allowing both traditional manuscript submission and Open Access (author-pays OA) manuscript submission at the discounted rate of $1,950 per article.
  • The OA option will be offered to the author at the time the manuscript is submitted. If selected, the OA fee must be paid before the article is published in the journal. If you have unusual circumstances about this, please contact the Editor-in-Chief. 
  • The traditional option, if selected, enables access to all qualified subscribers and purchasers via IEEE Xplore. No OA payment is required. 
  • The IEEE peer review standard of excellence is applied consistently to all submissions. All accepted articles will be included in the print issue mailed to subscribers. The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual (https://pspb.ieee.org/images/files/files/opsmanual.pdf). Each published article is reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Content

The technical content of papers should be both new and significant. Experimental data should be complete and should include sufficient descriptions of experimental apparatus, methods, and relevant experimental conditions. References should be thorough and complete.

Papers Presented at Conferences

Papers previously or planned to be presented at/published by conferences will be considered for publication under the following conditions.

  • The author must disclose information on conference presentation when the paper is submitted for review.
  • The author must significant additions/modification to the paper. This could include: new data and detailed analysis of the experimental results; addition of references to the previous work of others (not previous work by the authors); a discussion of the previous work and how the author’s work expands or builds on the previous work: a discussion of how the author’s results compare/contrast the previous work; etc.
  • The author must include a reference the previously published paper in the reference section.
  • The author should modify the title to reflect the fact that  the paper has been “significantly” modified.
  • A description of the modifications must be provided at the time of submission (either in the Author’s cover letter, or in a file uploaded with the manuscript.

Resources for Authors       

The IEEE Author Center contains tools and information to assist with article preparation and submission, the article proof review process, ordering reprints, and other helpful tips and guidelines. 

EPS Vice President, Publications:  Ravi Mahajan    

 
 

EPS publications advance theory and practice within the key technology areas of components, packaging and manufacturing technology.  Whether through the peer-reviewed papers in the IEEE Transactions on Components, Packaging and Manufacturing Technology, as well as other technically-related IEEE Transactions available to EPS Members, or through high-quality papers in the many conference proceedings sponsored through EPS -- readers have access to the information they need to stay current and excel in today's fast-moving technical world.

Transactions

All EPS members receive on-line access to the IEEE Transactions on Components, Packaging and Manufacturing Technology as part of their membership -- not additional cost.  Print copies are available for an additional fee.

NEW: The IEEE Transactions on Components, Packaging and Manufacturing Technology will now include a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.  The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.

The technical content of papers must be both new and significant.

Manuscript Length: The standard length for an accepted Letters manuscript must not exceed 4 pages. The 4th page is reserved exclusively for references in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and DOI (where available). 

When submitting your Letters into ScholarOne, select "Letters" as paper type.

Template for Letters in Transactions

Most Popular Articles in T-CPMT

 The following Transactions are also available to EPS members at discounted member rates:

IEEE Transactions on Semiconductor Manufacturing

IEEE Transactions on Nanotechnology

IEEE Sensors Journal

 

Please note: The IEEE/OSA Journal of Display Technology has ceased publication as of it's October-December 2016 issue. The archival content continue to be accessible to readers on the IEEE Xplore platform

Newsletter

The EPS Newsletter contains information on various Society activities, including conference announcements and post conference reports; and news on publications, awards and chapter activities.  The Newsletter is sent to all EPS Members quarterly via e-mail and in print.

 

Conference Proceedings

EPS Members can access papers from Conference Proceedings in the IEEE Xplore® digital library through individual subscriptions such as the Member Digital Library.

The IEEE Member Digital Library gives you instant access to all IEEE journal articles, magazines, and conference papers—the most essential information in technology today. With two great options designed to meet the needs—and budget—of every IEEE member, simply choose the subscription that’s right for you:

        IEEE Member Digital Library—25 articles per month for the power researcher
        IEEE Member Digital Library Basic—three articles per month to stay up-to-date

Full proceedings (all papers) from individual EPS and IEEE conferences are also available for purchase.

 

Individual Articles

Articles from any IEEE Transactions or conference are available for purchase on a single article basis. IEEE articles may be purchased online, one at a time, using a credit card.

EPS Newsletter Editor:  Kitty Pearsall

Submit article/news 

The EPS Newsletter contains information on various Society activities, including conference announcements and post conference reports; and news on publications, awards and chapter activities.  The Newsletter is typically sent to all EPS members three or four times a year (Winter, Spring, Summer, Fall) via e-mail and in print.

In between dissemination of the Newletter, members may receive EPS eNotices -- e-mails containing collections of conference/workshop announcements and calls for papers, as well as important Society news.

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