July 2023
Contribute to the research in your field by becoming an IEEE peer reviewer. Peer reviewers fulfill a vital role in the publishing process by giving detailed and professional commentary.
T-CPMT Associate Editors select potential peer reviewers who are experts in the topics that are covered in the article submission. After identifying reviewers, the system will send out invitations. Most invitations will include information about the article, such as the title and abstract, to help the reviewer decide if they should accept the invitation.
Selection Criteria:
- Minimum of bachelor’s or master’s degree in Material Science, Electrical Engineering, Mechanical Engineering or any related inter- disciplinary field
- Notable Publications in the field of expertise.
- Considerable Industry or academia experience.
Title: Sustainable Smart Lighting Technology State-of-Art and Roadmap to the Future
Date: July 28, 2023
Time: 11:00 am – 12:00 pm
Speaker: Prof. Georges ZISSIS, University of Toulouse, France (georges.zissis@laplace.univ-tlse.fr)
Abstract:
During the last decade, SSLs-Solid-State Lighting based on components like LEDs, OLEDs, and LDs, challenges conventional technologies. LED has turned into a game changer beating conventional technologies in all aspects. It is therefore anticipated that in short term, all the electric lighting will be based on SSLs. Today, SSLs proceed to the projected conclusion: replacing all legacy technologies, this is a major change in the lighting market that is considered a revolution.
Bio:
Prof. Georges ZISSIS, PhD, SMIEE, Vice-Rector Toulouse 3 University (2020-23). Born in Athens in 1964, has graduated in 1986 from Physics department of University of Crete in general physics. He got his MSc and PhD in Plasma Science in 1987 and 1990 from Toulouse 3 University (France). He is today full Professor in Toulouse 3 University (France). His primary area of work is in the field of Light Systems Science and Technology.
Fourth Annual Symposium on Reliability for Electronics and Photonics Packaging (REPP)
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh)
16‐17 November 2023 SEMI World Hdqtrs, Milpitas, CA USA
REPP’23 is planned to be a hybrid event, with both in‐person and WebEx participation
REPP’23 is planned to be a hybrid event, with both in‐person and WebEx participation This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state‐of‐the‐art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability‐related aspects: design‐for‐reliability, manufacturing, reliability modeling and accelerated testing.
The 24th European Microelectronics Packaging Conference (EMPC 2023) will return to the United Kingdom after 12 years and will be hosted at the Wellcome Genome Campus in Hinxton, near Cambridge from 11 – 14th September 2023.
Headed by eminent Keynotes, the Programme comprising parallel Technical Sessions of slide and poster oral presentations, EMPC 2023 is a must for engineers and scientists to keep at the forefront of microelectronics technologies. Excellent Papers accepted by leading international referees are scheduled to be presented at the Conference Sessions comprising: Advanced Packaging Technologies, Performance and Reliability, Design & Process Optimisation, Markets and Developments, Semiconductor Industry Trends, Applications, System Integration, Innovative Materials, Design and Test.
The EPS congratulations Madhavan Swaminathan upon receiving the 2024 IEEE Rao R. Tummala Electronics Packaging Technology Award "for contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems.”
The award, sponsored by the IEEE Electronics Packaging Society and Friends of Rao R. Tummala, recognizes meritorious contributions to the advancement of components, electronic packaging, or manufacturing technologies. Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.
The EPS congratulates the Malaysia EPS Chapter for receiving three prestigious awards at the IEEE Malaysia Inspiration Night 2023 held at the Sheraton Imperial Kuala Lumpur Hotel on June 24, 2023.
The chapter was presented with the 2022 IEEE Malaysia Outstanding Medium Chapter Award; won first place in the 2022 IEEE Malaysia Website Competition; and recognized EPS member Wong Shaw Fong with the 2022 IEEE Outstanding Industry Volunteer Award.
We are delighted to share with you the remarkable success of the Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity, organized by the Mid Hudson Valley EPS Chapter on June 21, 2023. This event held at the SUNY CNSE / IBM Research Campus in Albany, New York, brought together students and professionals from various backgrounds, regardless of their IEEE or EPS membership status.
The Mini Colloquium aimed to shed light on the latest trends in semiconductor packaging within the New York region, and we were privileged to have the participation of three distinguished subject matter experts and technology leaders in the field of electronic packaging. Their expertise and knowledge captivated the engaged audience throughout the session, fostering an atmosphere of learning and collaboration.
You can find the most accessed T-CPMT articles on Xplore here.