eps logo

 ECTC 2023 Best Papers will be available on Xplore as Open Access until June 1, 2024.

1) Best Session Paper

Fine Pitch Die-to-Wafer Hybrid Bonding       

Thomas Workman, Jeremy Theil, Gill Fountain, Dominik Suwito, Cyprian Uzoh, Guilian Gao, K. M. Bang, Bongsub Lee, Laura Mirkarimi – Adeia


2) Outstanding Session Paper

A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature Pre-Bonding

Yasuhisa Kayaba, Yuzo Nakamura, Wataru Okada, Takuo Shikama, Kahori Tamura, Satoshi Inada – Mitsui Chemicals, Inc.  


3) Best Interactive Presentation Paper

50 nm Overlay Accuracy for Wafer-to-Wafer Bonding by High-Precision Alignment Technologies      

Hajime Mitsuishi, Hiroshi Mori, Hidehiro Maeda, Mikio Ushijima, Atsushi Kamashita, Masashi Okada, Masanori Aramata, Takashi Shiomi, Shinya Sakamoto, Kishou Takahata, Tomohiro Chiba, Minoru Fukuda, Masahiro Kanbayashi, Toshimasa Shimoda, Isao Sugaya – Nikon Corporation


4) Outstanding Interactive Presentation Paper

Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration

Ralf Schmidt, Christian Schwarz – Atotech (MKS Instruments)


5) Intel Best Student Paper

Thermal-Aware SoC Macro Placement and Multichip Module Design Optimization with Bayesian Optimization            

Michael Molter, University of Illinois Urbana-Champaign,  Rahul Kumar, Sonja Koller, Osama Waqar Bhatti, Nikita Ambasana, Elyse Rosenbaum and Madhavan Swaminathan


6) Intel Outstanding Student Paper Award

Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy             

Shengtao Yu,  Georgia Institute of Technology, Thomas K. Gaylord, Muhannad S. Bakir     


7) TI Best IP Student Award

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications      

Xinyue Wang, Fudan University, Zhoudong Yang, Fudan University, Guoqi Zhang, TU Delft, Jing Zhang, Heraeus Materials Technology, Pan Liu, Fudan University

ECTC 2024 Banner JPG 

ECTC is the only event that offers an outstanding array of packaging technology information and four full days of engaging seminars. The over 350 technical papers cover advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, quantum electronics, flexible and printed electronics.

The 2024 Program Includes:

  • 41 Technical sessions with a total number of 350+ technical papers including:
  • 5 Interactive Session including one student session
  • 9 Special invited sessions plus a diversity panel and a Young Professionals event
  • 16 CEU-approved Professional Development Courses

With multiple opportunities for networking and a Technology Corner Exhibit that showcases industry-leading product and service companies from around the world, the ECTC is where you belong. Welcome back to the in-person conference format.

To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group to receive the latest updates on the most important topics in microelectronic packaging.

Register here

More information

BUSS’24 is a two-day, in-person event

Date: May 2-3, 2024

Location: At SEMI World Headquarters, Milpitas, CA

Sponsored by the Santa Clara Valley EPS Chapter

The Symposium focus is on substrate activities starting up in the USA. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users, with top-level presentations, panels, and discussions.

Read More 

Title: Nanostructured Thermal Interface for Advanced Thermal Management

Date: 29 March, 2024

Time: 1:00 p.m. (UTC-05:00) Eastern Time (US & Canada)

Platform: Webex

Presenter: Dr. Sheng Shen (Carnegie Mellon)

Abstract: Thermal resistance of interfaces has been widely identified as the critical technical bottleneck in cooling electronic devices and systems. The “ideal” thermal interface materials must simultaneously possess high thermal conductivity for minimizing thermal resistance, and high flexibility and compliance for adapting to soft and curved surfaces and accommodating the thermal stress derived from the mismatch of thermal expansion between two jointed materials. However, conventional thermal interface materials, such as solders, greases, gels and epoxies, cannot satisfy the demanding technical criteria, making the development of high-performance thermal interfaces extremely imperative. Solders display high thermal conductivity but feature poor mechanical compliance. Thermal greases, epoxies and other polymer-based composites have high compliance but struggle with low thermal conductivity.

Bio: Sheng Shen is a Professor at the Mechanical Engineering Department of Carnegie Mellon University (CMU). He also holds courtesy appointments in both the Electrical and Computer Engineering and the Materials Science and Engineering Departments at CMU. He received his PhD degree from the Mechanical Engineering Department, MIT, in 2010. Prior to joining CMU in 2011, he conducted his postdoctoral research at UC-Berkeley. His research interests include nanoscale heat transfer and energy conversion, nanophotonics, and their applications in energy conversion, thermal management, sensing, and multifunctional materials. 

Register here

Read more

Luu Nguyen

 Member, IEEE Future Directions Committee (FDC)

 Co-Chair IEEE Quantum


AI has so overwhelmingly dominated the news cycle lately that one would think that it is the only technology game-changer in town.  Where is AI heading?  How will it shape the future?  As Niels Bohr had said: “Prediction is very difficult, especially if it’s about the future.”  Technology predictions are harder in terms of timing and business components.  The IEEE Industry Advisory Board (IAB) has mainly focused on Megatrends within the last few years to provide a broader context and insight.  A Megatrend is not a temporary fashionable technology originating from a single contributing IEEE Society or is limited to a region.  It influences the evolution of multiple trends and impacts multiple factors (technological, economic, ecological, and social.)

Three Megatrends were identified:  Digital Transformation, Sustainability, and Artificial General Intelligence.  At the February 16-17, 2024 Quarterly Review meeting of FDC in Orlando, FL, the IAB summarized the latest refresh on these megatrends.  Figure 1 compares a Top-Down vs. Bottom-up view of the Megatrends against technology predictions that have popped up in 2024.

Read more

The Heterogeneous Integration Roadmap (HIR) 7th Annual Conference, held at the auditorium of the Samsung Electronics Campus North First Street San Jose California on February 21-23, 2024, was a huge success.  

Day 1

The conference started on Wednesday February 21st 1 pm devoting the entire afternoon to describing the US National Advanced Packaging and Manufacturing and Project (NAPMP). The keynote speaker was NAPMP Director Professor Professor Subramanian S. Iyer, Chair Professor at UCLA, on assignment to NIST to lead the US CHIP Act program.  

HIR Presentations

Read more

The NIST Office of Advanced Manufacturing (OAM) is seeking an Advanced Manufacturing Technology Fellow to work with OAM via an Intergovernmental Personnel Act (IPA)* agreement or interagency detail for one to three-years starting July 2024 or later. OAM coordinates Manufacturing USA – a growing national network of R&D institutes, each with a unique technological concentration. OAM is currently planning institutes in new technologies, including in microelectronics. Manufacturing USA was created to secure U.S. global leadership in advanced manufacturing through large-scale public-private collaboration on technology research, supply chains, and education and workforce development.

Read more

You can find the most accessed T-CPMT articles on Xplore here