ECTC 2023 Best Papers Available as OA on Xplore

ECTC 2023 Best Papers will be available on Xplore as Open Access until June 1, 2024.

1) Best Session Paper

Thomas Workman, Jeremy Theil, Gill Fountain, Dominik Suwito, Cyprian Uzoh, Guilian Gao, K. M. Bang, Bongsub Lee, Laura Mirkarimi – Adeia

2) Outstanding Session Paper

A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature Pre-Bonding

Yasuhisa Kayaba, Yuzo Nakamura, Wataru Okada, Takuo Shikama, Kahori Tamura, Satoshi Inada – Mitsui Chemicals, Inc.

3) Best Interactive Presentation Paper

50 nm Overlay Accuracy for Wafer-to-Wafer Bonding by High-Precision Alignment Technologies

Hajime Mitsuishi, Hiroshi Mori, Hidehiro Maeda, Mikio Ushijima, Atsushi Kamashita, Masashi Okada, Masanori Aramata, Takashi Shiomi, Shinya Sakamoto, Kishou Takahata, Tomohiro Chiba, Minoru Fukuda, Masahiro Kanbayashi, Toshimasa Shimoda, Isao Sugaya – Nikon Corporation

4) Outstanding Interactive Presentation Paper

Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration

Ralf Schmidt, Christian Schwarz – Atotech (MKS Instruments)

5) Intel Best Student Paper

Thermal-Aware SoC Macro Placement and Multichip Module Design Optimization with Bayesian Optimization

Michael Molter, University of Illinois Urbana-Champaign, Rahul Kumar, Sonja Koller, Osama Waqar Bhatti, Nikita Ambasana, Elyse Rosenbaum and Madhavan Swaminathan

6) Intel Outstanding Student Paper Award

Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy

Shengtao Yu, Georgia Institute of Technology, Thomas K. Gaylord, Muhannad S. Bakir

7) TI Best IP Student Award

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

Xinyue Wang, Fudan University, Zhoudong Yang, Fudan University, Guoqi Zhang, TU Delft, Jing Zhang, Heraeus Materials Technology, Pan Liu, Fudan University