7th Annual HIR Workshop February 2024
Presentations from the 7th Annual HIR Symposium - February 2024
Feb 21, 2024
Keynote: National Advanced Packaging Manufacturing Program
Feb 22, 2024
Keynote 1: Advanced Packaging in the Era of HPC and AI
Keynote 3: Challenges and Opportunities in Manufacturing 3DHI Microsystems
Additively Manufactured Electronics TWG
* TWG - Technical Working Group