Heterogeneous Integration Roadmap (HIR) 7th Annual Conference Report
The Heterogeneous Integration Roadmap (HIR) 7th Annual Conference, held at the auditorium of the Samsung Electronics Campus North First Street San Jose California on February 21-23, 2024, was a huge success.
Day 1
The conference started on Wednesday February 21st 1 pm devoting the entire afternoon to describing the US National Advanced Packaging and Manufacturing and Project (NAPMP). The keynote speaker was NAPMP Director Professor Professor Subramanian S. Iyer, Chair Professor at UCLA, on assignment to NIST to lead the US CHIP Act program.