ECTC 2024 Registration is Open
ECTC is the only event that offers an outstanding array of packaging technology information and four full days of engaging seminars. The over 350 technical papers cover advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, quantum electronics, flexible and printed electronics.
The 2024 Program Includes:
- 41 Technical sessions with a total number of 350+ technical papers including:
- 5 Interactive Session including one student session
- 9 Special invited sessions plus a diversity panel and a Young Professionals event
- 16 CEU-approved Professional Development Courses
With multiple opportunities for networking and a Technology Corner Exhibit that showcases industry-leading product and service companies from around the world, the ECTC is where you belong. Welcome back to the in-person conference format.
To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group to receive the latest updates on the most important topics in microelectronic packaging.