Upcoming IEEE EPS TM TC Webinar
Title: Nanostructured Thermal Interface for Advanced Thermal Management
Date: 29 March, 2024
Time: 1:00 p.m. (UTC-05:00) Eastern Time (US & Canada)
Platform: Webex
Presenter: Dr. Sheng Shen (Carnegie Mellon)
Abstract: Thermal resistance of interfaces has been widely identified as the critical technical bottleneck in cooling electronic devices and systems. The “ideal” thermal interface materials must simultaneously possess high thermal conductivity for minimizing thermal resistance, and high flexibility and compliance for adapting to soft and curved surfaces and accommodating the thermal stress derived from the mismatch of thermal expansion between two jointed materials. However, conventional thermal interface materials, such as solders, greases, gels and epoxies, cannot satisfy the demanding technical criteria, making the development of high-performance thermal interfaces extremely imperative. Solders display high thermal conductivity but feature poor mechanical compliance. Thermal greases, epoxies and other polymer-based composites have high compliance but struggle with low thermal conductivity.
Bio: Sheng Shen is a Professor at the Mechanical Engineering Department of Carnegie Mellon University (CMU). He also holds courtesy appointments in both the Electrical and Computer Engineering and the Materials Science and Engineering Departments at CMU. He received his PhD degree from the Mechanical Engineering Department, MIT, in 2010. Prior to joining CMU in 2011, he conducted his postdoctoral research at UC-Berkeley. His research interests include nanoscale heat transfer and energy conversion, nanophotonics, and their applications in energy conversion, thermal management, sensing, and multifunctional materials.