EPS Mid Hudson Chapter Mini Colloquium 2023 Report

We are delighted to share with you the remarkable success of the Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity, organized by the Mid Hudson Valley EPS Chapter on June 21, 2023. This event held at the SUNY CNSE / IBM Research Campus in Albany, New York, brought together students and professionals from various backgrounds, regardless of their IEEE or EPS membership status.

The Mini Colloquium aimed to shed light on the latest trends in semiconductor packaging within the New York region, and we were privileged to have the participation of three distinguished subject matter experts and technology leaders in the field of electronic packaging. Their expertise and knowledge captivated the engaged audience throughout the session, fostering an atmosphere of learning and collaboration.