February 2024
The premier international packaging, components, and
microelectronics systems technology conference
ECTC is the only event that offers an outstanding array of packaging technology information and four full days of engaging seminars. The over 350 technical papers cover advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, quantum electronics, flexible and printed electronics.
Start time: 21 Feb 2024 01:00 PM
End time: 23 Feb 2024 05:00 PM
All times are (UTC-08:00) Pacific Time (US & Canada)
Location: Samsung Electronics Campus
3655 N First Street, San Jose California, 95134
Title: Advanced Packaging for Integrated Photonics: From Research to Manufacturing
Date: 7 March, 2024
Time: 1:00 PM - 2:00 PM (UTC-05:00) Eastern Time (US & Canada)
IEEE IEMT 2024 invites you to submit your work to the 40th IEMT 2024 that will be held in G Hotel, Penang, Malaysia. It is an international event organized by the IEEE-EPS, Malaysia Chapter, with co-sponsorship from IEEE Electronic Packaging Society (EPS). The IEMT typically attracts more than 400 attendees from all over the world. The last IEMT 2022 (Putrajaya, Malaysia) hosted 600 attendees, with 100 accepted papers and interactive presentations featured in 16 sessions. IEMT 2024 welcomes papers covering electronics packaging technology in diverse semiconductor markets. This segment includes telecommunication, data center, automotive, EV, healthcare, aerospace, defense and others.
33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems
October 6-9, 2024, Toronto, Canada, www.epeps.org
EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems. Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for:
• signal integrity & power integrity
• advanced packaging and heterogeneous integration
• performance optimization
of systems for high-speed electronics, RF and wireless communication, and quantum computing.
Important dates
• Paper submission: June 14, 2024 (see template and instructions here)
• Acceptance: end of July 2024
• Sponsor registration: August 6th, 2024
• Early bird registration: September 6th, 2024
INTRODUCTION
The need to increase volumetric power density in automotive power electronics requires innovations in their thermal management systems. Automotive power electronics modules are typically cooled using a water-ethylene glycol (WEG) solution. Modern automotive systems use baseplate-cooled or double-side-cooled configurations to cool the power modules. The baseplate-cooled configuration is used for single-side-cooled modules and directly cools the module’s baseplate, eliminating the need for thermal grease. The ceramic component in the metalized ceramic substrates is typically the largest thermal resistance within the packaging structure. Double-side-cooled modules are typically compressed between two cold plates and use thermal grease at the module-to-cold-plate interface. The thermal grease layer is usually the largest thermal resistance for these double-side-cooled modules. The package conduction resistance is typically the largest thermal resistance. References [1–3] provide additional information on typical WEG-based power electronics cooling systems.
Volunteers are needed to serve as corporate officers, committee chairs, and members.
IEEE is governed by volunteer members and depends on them for many things, including editing its publications, organizing conferences, coordinating regional and local activities, writing standards, leading educational activities, and identifying individuals for IEEE recognitions and awards. See below for the complete list. To nominate a person for a position, complete this form.
The Nominations and Appointments (N&A) Committee is responsible for developing recommendations for staffing many volunteer positions including for president-elect and corporate officers. Its recommendations are sent to the Board of Directors and the IEEE Assembly.
You can find the most accessed T-CPMT articles on Xplore here.