EPEPS 2024 Call for Papers

33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems

October 6-9, 2024, Toronto, Canada, www.epeps.org

EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems.  Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for:

                                                                       • signal integrity & power integrity

                                                                       • advanced packaging and heterogeneous integration

                                                                       • performance optimization

of systems for high-speed electronics, RF and wireless communication, and quantum computing.

Important dates

• Paper submission:  June 14, 2024 (see template and instructions here)

• Acceptance:  end of July 2024

• Sponsor registration:  August 6th, 2024

• Early bird registration:  September 6th, 2024

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