Integrated Power Electronics Components for Integrated Voltage Regulators

I.  Introduction

Approximately a trillion transistors could be integrated in a System-in-Package (SiP) (Figure 1) by 2030  by  heterogeneously integrating many CPU, FPGA, AI accelerator, networking, memory, I/O and other chiplets. Chiplet power densities are forecast to increase to 2W/mm2 average with >9W/mm2 hotspots.  SiP performance is limited by the ability to deliver power to and remove heat from the SiP. 

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