New Digital Library with Membership
NEW – Society Member Digital Library
Beginning with the 2023 renewal cycle, EPS members will have access to the new EPS Digital Library!
This will include online access via Xplore to the Transactions on Components, Packaging and Manufacturing Technology (T-CPMT), EPS sponsored conference proceedings including ECTC, ESTC, ITherm and more!
Unlimited access to current and past issues of T-CPMT and proceedings for EPS sponsored conferences from current year to the early nineties.
Call for Participation at REPP Symposium 2022
The third annual Symposium on Reliability for Electronics and Photonics Packaging (REPP) will be held November 9 ‐10, 2022 at SEMI Headquarters, Milpitas, CA, USA.
REPP’22 is planned to be a hybrid event, with both in‐person and WebEx participation
This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
Upcoming Conferences
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2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) Grenoble, France Aug 24, 2022 - Aug 26, 2022 |
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Sibiu, Romania Sep 13, 2022 - Sep 16, 2022 |
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2022 44th Annual EOS/ESD Symposium (EOS/ESD) Reno, NV USA Sep 18, 2022 - Sep 23, 2022 |
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2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Dublin, Ireland Sep 28, 2022 - Sep 30, 2022 |
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2022 13th International Conference on Computing Communication and Networking Technologies (ICCCNT) Kharagpur, India Oct 3, 2022 - Oct 5, 2022 |
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2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA USA Oct 9, 2022 - Oct 12, 2022 |
33rd Annual Electronics Packaging Symposium 2022
We are pleased to announce our 2022 Electronics Packaging Symposium will take place September 7-8, 2022 at Binghamton University Campus as a live event!! We will be planning a smaller event than we had done in past symposiums as we try to take into consideration those that are still hesitant to travel. The focus of our symposium will be the needs and the challenges of the electronics industry. We will be updating this webpage with the session titles and keynote speakers as we get on with our planning. We look forward to seeing you in September.
2022 IEEE SCV Section Outstanding Engineer Award
Congratulations to Dr. Ephraim Suhir, recipient of the 2022 IEEE Santa Clara Valley Section Outstanding Engineer Award "for seminal contributions to several critical IEEE fields, including probabilistic design-for-reliability of microelectronic and photonic materials and systems, and the role of the human factor."