Call for Participation at REPP Symposium 2022

The third annual Symposium on Reliability for Electronics and Photonics Packaging (REPP) will be held November 9 ‐10, 2022 at SEMI Headquarters, Milpitas, CA, USA.

REPP’22 is planned to be a hybrid event, with both in‐person and WebEx participation

This symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.