Call for Papers Deadline Extended: T-CPMT Special Section on Power Electronics Packaging

The timeline for the IEEE Transactions on Components, Packaging, and Manufacturing Technology (T-CPMT) Call for Papers for the Special Section focused on multi-physics aspects of packaging of power electronics at the die/chip, module and converter scales has been extended.

Call for Papers: April 30, 2023

Draft Manuscripts due: October 15, 2023

Submission of Final Manuscripts and CopyRight Forms: March 15, 2024

Publication: April, 2024

Authors should select "Special Section on Power Electronics" when submitting their papers and note in their cover letter that the manuscript is being submitted for the Special Section on Power Electronics Packaging. This will ensure that the manuscript is assigned correctly.

The IEEE T-CPMT is a flagship journal focused on advancing the knowledge and dissemination of research on multiple electronics packaging technologies.