34th Annual Electronics Packaging Symposium
Binghamton University, GE Global Research and IBM Research are proud to host the 34th Annual Electronics Packaging Symposium — Small Systems Integration. The program will include two days of exciting invited presentations with a focus on supply chain interconnectivity. The theme this year is Packaging for AI and Workforce Development.
We invite you to join us for this in-person event on Sept. 7-8, 2022, at the Albany NanoTech Complex, Albany, NY.
Registration closes August 23, 2023.