EDAPS 2023 Call For Papers Submission Deadline Extended

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia-Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, EDAPS 2023 will be held in the paradise island of Mauritius, December 12-14, 2023. For further information, please visit the website at edaps.org.

Important Dates

Manuscript Submission Deadline: September 12th, 2023

Notification of Acceptance: October 12th, 2023

Conference Date: December 12th-14th, 2023