2024 IEEE Rao R. Tummala Electronics Packaging Award Recipient
The EPS congratulates Madhavan Swaminathan, recipient of the 2024 Rao Tummala Electronics Packaging Award, "for contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems."
Over his illustrious career, Madhavan Swaminathan has consistently taken a lead role in offering solutions for engineers to effectively create high-performing designs. His work has led to a fundamental understanding of power distribution networks (PDNs), design of package architectures that improve power efficiencies, and glass packaging for millimeter wave (mm wave) applications. These efforts laid the foundation for several commercially available modeling tools, along with delivering significant performance improvements for high-speed computing, wireless, and mixed signal electronic systems. Swaminathan literally wrote the book on modern PDNs, as the book he authored on the subject is now used by universities and industry worldwide.
An IEEE Fellow, Swaminathan is Department Head of Electrical Engineering, William E. Leonhard Endowed Chair, and Director of CHIMES (an SRC JUMP 2.0 Center), College of Engineering, Penn State University, Pennsylvania, USA
The Rao Tummala Electronics Packaging Award, an IEEE Technical Field Award, sponsored by the EPS and administered by the IEEE Awards Board, is the highest award honoring technical achievement in EPS fields of interest.