Title: Heterogeneous Integration of Surface Ion Trap, Silicon Photonics and 3D-TSV for Quantum Computing
Date: February 25, 2021
Time: 6:00 - 7:30 PT
Presenter: Chuan Seng Tan
The past decade has been exciting years for quantum computing. In 2016, IBM introduced the first superconductor-based quantum computer (IBM Q) entangling all 16 qubits with great versatility in nuclear magnetic resonance and cavity quantum electrodynamic applications. Meanwhile, Google reported quantum supremacy in the use of the Sycamore processor with 53 programmable superconducting qubits, taking 200 seconds to perform computing tasks which would take approximately 10,000 years in classical computers. To further improve the qubit performances (e.g. fidelity, coherent time) and scalability, ion qubits have been widely reported in quantum computing applications. MIT and ETH Zurich have reported the integration of on-chip photonics components into surface electrode (SE) ion traps. For the industrialization of ion trap quantum computing devices, Honeywell reported quantum charge coupled devices (QCCD) which trap, transport and address multiple ions simultaneously. However, these quantum computing devices require niche fabrication techniques which limits the universality of quantum computing technology.