PSMA and IEEE EPS invite you to attend the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-23). This Symposium brings synergistic advances in component design and integration combined with 3D manufacturing technologies – customized to different market segments such as computing, automotive industry, energy sector, and low-power medical and wearables systems.This Symposium provides the opportunity to share progress in design, active and passive components, and integration combined with 3D manufacturing technologies for power electronics packaging.
The Symposium will be held February 1-3, 2023, at Florida International University, Miami, FL, USA., offering an opportunity to get a “winter warm-up” on Florida’s enticing beaches.
Created and supported by the PSMA’s Packaging & Manufacturing Committee, 3D-PEIM will feature invited papers highlighted by plenary and keynote addresses and contributed presentations by Industry and Academia experts. Speakers will address mechanical, materials, reliability, and manufacturability issues. There will be Exhibits and an Exhibit Sponsor’s Session.