Distinguished Lecture by Dr. John H. Lau: Chiplet Design and Heterogeneous Integration Packaging

The distinguished lecture was presented by Dr. John Hon Shing Lau with the topic of "Chiplet Design and Heterogeneous Integration Packaging" at Tsinghua University, May 11. The lecture was hosted by EPS Beijing Chapter.

Dr. Lau introduced the main driving forces of the rapid development of Chiplet. He expressed that, the feature size that a monolithic SoC can use has been limited by technology and cost factors at present, and it has become increasingly difficult to continue scaling in accordance with Moore's Law. Meanwhile, cost can be significantly reduced because the manufacturing yield improves as die size gets smaller. As a result, Chiplet is becoming an emerging solution that has gained widespread attention.