Heterogeneous Integration Session at SEMICON West 2023

Co-hosted by the IEEE Electronics Packaging Society (EPS) and the SEMI Americas Advanced Packaging Committee

Date: Wednesday, July 12, 2023
Time: 2:00-4:30 p.m. PST
Location: TechTalk Stage, Moscone South

Heterogeneous Integration through advanced packaging innovations is widely acknowledged as being increasingly important to drive performance, system availability, power efficiency, cost and time to market of microelectronics systems, from HPC & Data Centers, to 5G & Beyond, mobile, automotive, IoT, medical and health markets.

As the full microelectronics design and manufacturing supply chain come together to respond to challenges and develop new solutions, two integration technologies, in particular, are paving the way to make these innovations possible – System in Package (SiP) and Chiplets Integration. HPC systems have adopted the mantra of co-design at the system-level to address waning performance gains from shrinking transistors. By co-designing in a system-application approach, innovators across the whole ecosystem will deliver the next extension of Moore’s law in the next decade and more years.

This Heterogeneous Integration session takes a full ecosystem approach to look at how advanced packaging in SiP and Chiplets are paving the way for the Future of HPC and Hyperscale computing.