EDAPS 2023 Call For Papers

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia-Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, EDAPS 2023 will be held in the paradise island of Mauritius, December 12-14, 2023. For further information, please visit the website at edaps.org

Papers should be submitted electronically in two-column and three-page PDF file format through the EDAPS website (www.edaps.org). A Microsoft Word template is available on the symposium website. Hardcopy submissions will NOT be accepted. Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Non-compliant manuscripts will not be considered for review. Submission deadline is August 12, 2023.