Heterogeneous Integration Technologies for Scaled Quantum Information Processing Systems
Michael Hamilton (*) and Luu Nguyen (**)
(*) Auburn University; Director, Alabama Micro/Nano Science and Technology Center
(**) PsiQuantum; Co-Chair, IEEE Quantum
Quantum information processing (QIP) can be performed using any multi-state quantum system that is sufficiently isolated from its surrounding thermal and dissipative environment while also being sufficiently controllable and addressable. These systems function as quantum bits (qubits) and quantum-limited sensors that are used for information-processing tasks such as computing and sensing. Leveraging the incredible technology and related infrastructure developed for integrated solid-state systems, such as CMOS, is expected to yield efficient routes to realize densely integrated QIP systems with many more qubits, which is much more computationally powerful than demonstrated systems (with qubit numbers of order 100).
X-Ray Radiography Study of The Evolution of Defects in Solder Joints*
Govindarajan Muralidharan and Ercan Cakmak
Oak Ridge National Laboratory Oak Ridge, TN, USA
muralidhargn@ornl.gov, cakmake@ornl.gov
Abstract
With the advent of wide band-gap devices which can operate at higher temperatures than Si-based devices, there is interest in the evaluation of Au-based solders or alternate materials for use as die-attach materials. In this study, X-ray radiography and X-ray tomography were used to characterize the evolution of defects due to thermal cycling in Au-based materials used as a die-attach and in brazed joints. Evolution of voids and cracks as a function of thermal cycling was clearly observed using these techniques, highlighting their potential role in understanding joint behavior at high temperatures and after thermal or power cycling.
EPTC 2023 First Call for Papers
The 25th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. EPTC2023 will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.
The EPTC technical program committee, with more than 100 experts from diverse semiconductor packaging technology areas, is committed to creating an engaging technical program for the international packaging community. The technical program will be supplemented by an exhibition, which provides an opportunity for leading companies to exhibit their latest technologies and products. Last year there were 430 attendees. This year being our 25th Anniversary, we have a special 4-day program and expect more attendees.
Additive manufacturing for nano-feature applications: Electrohydrodynamic printing as a next-generation enabling technology
Goran Miskovic (IEEE Senior Member) and Robin Kaufhold
Silicon Austria Labs, Europastraße 12, Villach, Austria
E-Mail: goran.miskovic@silicon-austria.com, robin.kaufhold@silicon-austria.com
Abstract
Regardless of the technology, additive or subtractive, the miniaturization trend is constantly pushing for smaller resolutions. The rise of global challenges in material availability, fabrication in three dimensions (3D), design flexibility and rapid prototyping have pushed additive manufacturing (AM) into the spotlight. Addressing the miniaturization trend, AM has already successfully answered the challenges for microscale 3D fabrication. However, fabricating with nano resolution still presents a challenge. In this review, we will present some of the most reported AM-based technologies capable of nanoscale 3D fabrication addressing resolutions of ≤ 500 nm. The focus is placed on Electrohydrodynamic (EHD) printing (also known as e-jet printing), as EHD printing seems to have the best trade-off when it comes to technique complexity, achievable resolutions, material diversity and potential to scale-up throughput. An overview of the smallest achieved resolutions as well as the most unique use cases and demonstrated applications will be addressed in this work.
IEEE Quantum Week 2023 Call for Participation
Luu Nguyen
Co-Chair IEEE Quantum
Steering Committee of QCE23
IEEE Quantum Week (IEEE International Conference on Quantum Computing and Engineering (QCE)) is the flagship conference of the IEEE Quantum Initiative. It bridges the gap between the science of quantum computing and its ecosystem. It is a multidisciplinary venue that offers attendees the unique opportunity to discuss challenges and opportunities with quantum scientists, engineers, programmers, educators, and entrepreneurs.
EPS has been one of the ten co-sponsoring IEEE Societies.
QCE22 was held as a hybrid event in Broomfield, CO, on Sept. 18-22, 2022. It attracted over 1,050 attendees (68% in-person, 32% virtual). Over 250 hours of quantum were recorded comprising of 9 keynotes, 25 tutorials, 16 workshops, 13 panels, 67 technical papers, 59 posters, and 5 Birds-of-a-Feather sessions. Over 40 exhibits featured technologies from quantum companies, start-ups, and research labs. Quantum Week workshops have spawned twenty separate communities over the past three years.
QCE23 will also be a hybrid event, held in Bellevue, WA, on Sept. 17-22, 2023. After three successful IEEE Quantum Week events, we’re looking forward to developing an outstanding program to showcase quantum research, applications, education, and training.
For more information on the conference and participation details, check: https://bit.ly/qce23-contribute.