ICSJ 2023 Call for Papers

12th IEEE CPMT Symposium Japan November 15 – 17, 2023,

Venue: Ritsumeikan University Suzaku Campus, Kyoto, JAPAN (On-site only)

 "Advanced Packaging for Chiplet Era"

“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. This conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide a platform for you to communicate and interact with global leaders in packaging technology. 

Advanced Packaging for Chiplet Era: Chiplet architecture, moving from monolithic to multi-tile devices, is becoming a key technology to expand computing resources with integrated functional units on a same package. Chiplet is not only driving the packaging technology including 2.xD/3D integration and high density substrate technology with process and material, but also revolutionizing applications requiring highly advanced computing such as 5G, AI, automotive, edge computing and mobile components. The symposium tries to forecast where the packaging technology is heading. In 2023, our focus is on key electronics packaging technologies pulling by Chiplet architecture on the following main topics: Photonics, Advanced Packaging, Process & Material, Power & Automotive Electronics, Bioelectronics & Healthcare, and Signal/Power Integrity.

The abstract deadline is 29 May, 2023.

Submit abstracts here

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