Title: ML/AI in Semiconductor Packaging and Electronics Manufacturing
Date: 7th Dec 2021 (Tuesday)
Time: 10.00am – 11.00am (M’sia Time, GMT +8:00)
Platform: CISCO WebEx
Presenter: Dr. Dongkai Shangguan, IEEE Fellow, IMAPS Fellow, IEEE EPS Distinguished Lecturer
In the era of “More than Moore” and heterogeneous integration, many advanced semiconductor packaging processes have presented challenges in manufacturing. For example, precision alignment has been one of the key capabilities for several advanced technologies for heterogeneous integration, such as 2.5D/3D, optical assembly, etc.
This talk will present several important applications of ML/AI in semiconductor packaging, optical assembly, PCB assembly and other areas in electronics manufacturing. Applications such as traceability, predictive maintenance, productivity improvement, and process optimization, will be discussed. Various use cases will be discussed to demonstrate how an ML/AI platform at the Edge can be utilized to significantly improve the machine performance as well as yield and throughput for challenging processes. In particular, the presentation will focus on the application of ML/AI for precision alignment using real-time data routinely generated by the machine. Future industry perspectives will be outlined.
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