EPS Malaysia and IEEE Malaysia Section Advanced Packaging Workshop 2023 Report

Kai Chat Tan

IEEE EPS Malaysia and IEEE Malaysia Section hosted a highly successful Advanced Packaging Workshop on two separate occasions, on the 17th of October in Bangi, and on the 19th of October in Penang, covering the southern and northern regions of Malaysia. This event, with jointly supported by IEEE Malaysia Section of Professional Activities and Industrial Relations (PAIR), attracted a substantial turnout, with over 200 participants hailing from various prominent organizations, including NXP, onsemi, Intel, Micron, ST Microelectronics, University of Malaya and more.

The workshop featured the invaluable insights and expertise of IEEE EPS distinguished lecturers, Dr. Tanja Braun and Jan Vadarman. They presented the latest advancements in packaging technology within the industry and shed light on emerging trends, particularly within the realm of automotive applications.