Importance of Integrated Electrical and Thermo-Mechanical Co-optimization for Future Package Designs

  Aditya Vaidya                                    Yinglei Ren 

   Intel Corporation                                Intel Corporation

                                  aditya.s.vaidya@intel.com                  yinglei.re@intel.com                               

 INTRODUCTION  

The world is becoming increasingly impatient and demanding. There is need for fast internet, social media pages to load quickly, and have in-person feeling with colleagues while working from home. On a serious note, processing large amounts of data in the shortest amount of time has become the norm in a world dominated by artificial intelligence (AI), machine learning and large amounts of data in general. A direct consequence of this is on the bandwidth (BW) requirements for different communication protocols to and from a microprocessor. In recent years, the signaling speed for standard protocols like Memory and Peripheral Component Interconnect Express (PCIe) have been increasing at an exponential rate to get higher BW as shown in Figure 1 below [1,2].

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