Upcoming Webinar from the EPS Thermal and Mechanical Technical Committee
Title: Reliability and lifetime estimation of power electronic modules under high temperature loading conditions
Date: December 12, 2023
Time: 1:00 pm EST
Presenter: Paul Paret
Abstract: Advanced packaging technologies are currently being designed and developed by the power electronics industry however, the maximum operating temperature is still limited to 175°C for the silicon carbide devices. Bonded materials such as sintered silver, sintered copper, and polymeric materials are potential candidates for high temperature operation, but it is critical to characterize and evaluate its reliability under harsh operating conditions. In the first part of this webinar, the accelerated experiments and thermomechanical modeling results of these bonded materials, and their lifetime prediction models developed at the National Renewable Energy Laboratory (NREL) are discussed.
Bio: Paul Paret is a researcher in the Center for Integrated Mobility Sciences at the National Renewable Energy Laboratory. In this role, Paul leads the computational modeling efforts to simulate the thermal and thermomechanical behavior and develop lifetime prediction models of various bonded materials in power electronics packages used in electric-drive vehicles and aviation systems.