2022 Mid-Hudson Valley EPS Chapter Mini Colloquium Report

The Mid-Hudson Valley EPS Chapter hosted and organized a Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity in August 2022. It was open to all students and professionals, regardless of IEEE or EPS membership status. We invited subject matter experts and technology leaders in the various areas of electronic packaging to educate and inform our audience. A total of 112 individuals registered for this on site in person event at the SUNY CNSE / IBM Research Campus in Albany, New York.

The event was posted on Vtools, and publicized through various channels, including EPS, IEEE Region 1 announcements, and internally in various organizations and academic institutions, through email. Registration was free to all. The EPS MHV Chapter provided a mid-morning break with coffee, juice, and light refreshments. The attendees gave the chapter accolades in person because of the timely subject matter and the expertise of the speakers.