With renewal of your 2023 membership, EPS members will have access to the new EPS Digital Library!

This will include unlimited access, via Xplore, to the Transactions on Components, Packaging and Manufacturing Technology (T-CPMT) and earlier Transactions, and proceedings for EPS sponsored conferences from the current year to the early nineties,  including ECTC, ESTC, ITherm and more!

The 3rd IEEE International Conference on Quantum Computing and Engineering (QCE) was held on 9/18-23 in Broomfield, CO (https://qce.quantum.ieee.org/2022/).  QCE bridges the gap between the science of quantum computing and the development of its ecosystem.  After two successful virtual Quantum Week events during the pandemic, this year’s meeting attracted over 1000 attendees (about 700 in-person and 300 virtual).  Besides live exhibits, QCE22 offered 9 Keynote talks, 70 technical papers, 60 posters, 16 workshops, 25 tutorials, 13 panels, and 5 Birds-of-a-Feather sessions.  All the talks were recorded and made available on-demand on the Hubb virtual platform to all the registrants until November 15, 2022.

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The Mid-Hudson Valley EPS Chapter hosted and organized a Mini Colloquium on Advanced Technology for Inter-Chiplet Connectivity in August 2022. It was open to all students and professionals, regardless of IEEE or EPS membership status. We invited subject matter experts and technology leaders in the various areas of electronic packaging to educate and inform our audience. A total of 112 individuals registered for this on site in person event at the SUNY CNSE / IBM Research Campus in Albany, New York. 

The event was posted on Vtools, and publicized through various channels, including EPS, IEEE Region 1 announcements, and internally in various organizations and academic institutions, through email. Registration was free to all. The EPS MHV Chapter provided a mid-morning break with coffee, juice, and light refreshments. The attendees gave the chapter accolades in person because of the timely subject matter and the expertise of the speakers.

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Genaro Soto-Valle, Charles A. Lynch III, Manos M. Tentzeris

I. Introduction

In recent years, the tremendous growth in the demand for consumer electronics combined with the advances in the area of millimeter-waves (mmWave) has enabled great improvement in the field of Internet of Things (IoT), which is consequently paving the way for our societies to make the idea of Smart Cities possible. Some applications that lie under the ‘Smart Cities’ scope include structural health monitoring, ubiquitous biochemical and health monitoring, positioning and localization applications, as well as low-cost energy harvesting devices. In addition, the realm of virtual reality (VR) has also drawn tremendous attention among regular consumers, increasing the need for improving our current technologies related to digital twins in order to map physical objects into the digital world.

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The EPS proudly congratulates the inaugural receipent of the IEEE Certificate of Distinguished Achievement for Professional Engagement and Service:

Daniel Donahoe