2023 ECTC EPS President's Panel Report

How Can Photonics Enable the Bandwidth Densities with Lower Energy per Bit in Emerging SIP?

Amr S. Helmy

During the 73rd ECTC event, the President's panel directed its attention towards a pivotal inquiry: "How can Photonics Enable Bandwidth Densities with Lower Energy per Bit in Emerging SIP?" The panel engaged in an extensive discussion, delving into the tools, technologies, and notably, photonics-based approaches that hold the potential to elevate the industry's interconnection bandwidth density in System-in-Package (SiP) configurations. Within this discourse, the panel addressed some of the most formidable impediments to widespread adoption, including the challenge of achieving energy-efficient performance per bit that aligns with the industry's roadmaps and established standards for both package-level and on-chip interconnection protocols.

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