EPS EDMS Technical Committee Webinar
Title: EPS EDMS Packaging Benchmark Suite – Past, Present, and Future
Date: 25 October, 2023
Time: 3:00 pm – 4:00 pm (UTC-04:00) Eastern Time (US & Canada)
Where: Webex Platform
Presenters: Vladimir Okhmatovski, University of Manitoba; Heidi Barnes, Keysight Technologies
Moderator: Rohit Sharma
Abstract: The mission of the IEEE EPS EDMS Packaging Benchmarks Committee is to produce a Packaging Benchmark Suite that will encourage research & development by providing information about the electromagnetic, electrical, and circuit modeling and simulation problems encountered, and the state-of-the-art solution methods used when analyzing and designing electronic packages. This presentation will cover the current state of the available packaging benchmarks, technical challenges in creating real-world benchmarks, activities to encourage usage of the benchmarks, and opportunities going forward.
Bios:
Vladimir Okhmatovski is a professor with the Department of Electrical and Computer Engineering, University of Manitoba, Canada. His research interests are the fast algorithms of electromagnetics, high performance computing, modeling of interconnects, and inverse problems. He has worked extensively on computational electromagnetics projects with Sonnet, Cadence, Intel, CEMWorks, Resonant, DND Canada, and other industry and government agencies. He was a recipient of the 2017 Intel Corporate Research Council Outstanding Researcher Award, Outstanding ACES Journal Paper Award in 2007, and received various other honors.
Heidi Barnes is a Senior Application Engineer and Power Integrity Product Owner for High-Speed Digital applications in the EDA Software Solutions group of Keysight Technologies. Her recent activities include the application of electromagnetic, transient, and channel simulators to solve signal and power integrity challenges. She is the author of over 30 papers on SI and PI, technical contributor for the new IEEE-370 Standard involving interconnect S-parameter quality after fixture removal, and recipient of the DesignCon 2017 Engineer of the Year. Recently, she was elected Co-Chair for the IEEE EPS EDMS Packaging Benchmark Sub-Committee. Her past experience includes ATE, RF/Microwave microcircuit packaging, and aerospace instrumentation. Heidi graduated from the California Institute of Technology in 1986 with a bachelor’s degree in electrical engineering. She has been with Keysight EDA Software since 2012.