ECTC 2023 Call For Papers

Submit your abstract for the 73rd ECTC!
The premier international packaging, components, and microelectronics systems technology conference 

You are invited to submit an abstract proposal about new developments and technology related to the following:

  • Applied Reliability
  • Assembly and Manufacturing Technology
  • Emerging Technologies
  • RF, High-Speed Components & Systems
  • Interconnections
  • Materials and Processing
  • Packaging Technologies
  • Photonics
  • Thermal/Mechanical Simulation and Characterization
  • Interactive Presentations


Submission Guidelines

The content must be original, previously unpublished, non-confidential and without commercial content.

All abstracts and proposals must be submitted electronically at our website by 10 October 2022. Get more details here. Selected authors and instructors will be announced by 12 December 2022. The first 100 people to submit abstracts will be entered into a drawing to win a free ECTC 2023 registration.

Read more