Bio: P. Markondeya Raj - IEEE Electronics Packaging Society
IEEE Electronics Packaging Society IEEE Electronics Packaging Society
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) Melaka, Malaysia Sep 4, 2018 - Sep 6, 2018
2018 IEEE Electronic Design Process Symposium (EDPS) Milpitas, CA USA Sep 13, 2018 - Sep 14, 2018
30th Electronics Packaging Symposium Binghamton, NY Sep 18, 2018 - Sep 19, 2018
2018 7th Electronic System-Integration Technology Conference (ESTC) Dresden, Germany Sep 18, 2018 - Sep 21, 2018
2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) Reno, NV USA Sep 23, 2018 - Sep 28, 2018
2018 13th International Congress Molded Interconnect Devices (MID) Würzburg, Germany Sep 25, 2018 - Sep 26, 2018
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Stockholm, Sweden Sep 26, 2018 - Sep 28, 2018
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA USA Oct 14, 2018 - Oct 17, 2018
2018 IEEE Holm Conference on Electrical Contacts Albuquerque, NM USA Oct 14, 2018 - Oct 18, 2018
2018 15th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS) Shenzhen, China Oct 23, 2018 - Oct 25, 2018
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Taipei, Taiwan Oct 24, 2018 - Oct 26, 2018
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME) Iasi, Romania Oct 25, 2018 - Oct 28, 2018
2018 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 19, 2018 - Nov 21, 2018
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Singapore Dec 4, 2018 - Dec 7, 2018
2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Chandigarh, India Dec 16, 2018 - Dec 18, 2018
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Hong Kong Dec 17, 2018 - Dec 20, 2018
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Hannover, Germany Mar 24, 2019 - Mar 27, 2019
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Toulouse, France Apr 24, 2019 - Apr 26, 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Las Vegas, NV USA May 29, 2019 - May 31, 2019
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambéry, France Jun 18, 2019 - Jun 21, 2019
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) Pisa, Italy Sep 16, 2019 - Sep 19, 2019
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
View More Upcoming Conferences →
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Hong Kong Dec 17, 2018 - Dec 20, 2018 Abstract Submission Date: Aug 31, 2018
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Hannover, Germany Mar 24, 2019 - Mar 27, 2019 Abstract Submission Date: Oct 30, 2018
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Toulouse, France Apr 24, 2019 - Apr 26, 2019 Abstract Submission Date: Nov 17, 2018
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019 Abstract Submission Date: Oct 19, 2018
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Las Vegas, NV USA May 29, 2019 - May 31, 2019 Abstract Submission Date: Sep 3, 2018
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IEEE Electronics Packaging Award

 Bill Screen Shot Image 2

Recipient of 2018

IEEE Electronics Packaging Award

William Chen

         Fellow of ASE Group, Sunnyvale, California, USA 

“For contributions to electronic packaging from research and development through industrialization, and for his leadership in strategic roadmapping efforts.”
 
 

2018 7th Electronic System-Integration Technology Conference (ESTC)

 September 18-21, 2018

Dresden, Germany

 

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