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2022 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)
Milpitas, CA USA
Nov 9, 2022 - Nov 10, 2022
Abstract Submission Date: Aug 22, 2022
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2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Saratoga Springs, NY USA
May 1, 2023 - May 4, 2023
Abstract Submission Date: Oct 21, 2022
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Orlando, FL USA
May 29, 2023 - Jun 3, 2023
Abstract Submission Date: Oct 10, 2022
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Orlando, FL USA
May 30, 2023 - Jun 2, 2023
Abstract Submission Date: Sep 5, 2022
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IEEE Electronics Packaging Award
Recipient of the 2022
IEEE Rao R. Tummala Electronics Packaging Award
Douglas C. H. Yu
"“For contributions to the development of advanced packaging technologies and their implementation in high-volume manufacturing.”
August 10-13, 2022
Dalian, China
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