2021 IEEE International 3D Systems Integration Conference (3DIC) Raleigh, NC USA Oct 25, 2021 - Oct 28, 2021
2021 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 9, 2021 - Nov 11, 2021
2022 IEEE Design and Technology of Modern Electronic Systems (DTMES) Addis Ababa, Ethiopia Feb 7, 2022 - Feb 9, 2022
2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 1, 2022 - May 4, 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 29, 2022 - Jun 3, 2022
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) Aalborg East, Denmark Aug 23, 2022 - Aug 25, 2022
2022 IEEE 67th Holm Conference on Electrical Contacts (HLM) Tampa, FL USA Oct 22, 2022 - Oct 25, 2022
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 26, 2024 - May 31, 2024
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) Orlando, FL USA May 25, 2025 - May 30, 2025
2025 IEEE 70th Holm Conference on Electrical Contacts (HLM) San Antonio, TX USA Oct 14, 2025 - Oct 21, 2025
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) San Diego, CA USA May 24, 2026 - May 29, 2026
2027 IEEE 77th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 30, 2027 - Jun 4, 2027
2028 IEEE 78th Electronic Components and Technology Conference (ECTC) Grapevine, TX USA May 28, 2028 - Jun 2, 2028
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IEEE Electronics Packaging Award

Douglas C.H. Yu 

Recipient of the 2022

IEEE Rao R. Tummala Electronics Packaging Award

Douglas C. H. Yu

"“For contributions to the development of advanced packaging technologies and their implementation in high-volume manufacturing.”

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October 24 - 27, 2021
San Antonio, TX

October 25 - 28, 2021
Raleigh, NC

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