2018 International Wafer Level Packaging Conference (IWLPC) San Jose, CA USA Oct 23, 2018 - Oct 25, 2018
2018 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 19, 2018 - Nov 21, 2018
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Toulouse, France Apr 24, 2019 - Apr 26, 2019
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Saratoga Springs, NY USA May 6, 2019 - May 9, 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, NV USA May 25, 2019 - Jun 2, 2019
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambéry, France Jun 18, 2019 - Jun 21, 2019
2019 IEEE Holm Conference on Electrical Contracts Milwaukee, WI USA Sep 14, 2019 - Sep 18, 2019
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Lake Buena Vista, FL USA May 26, 2020 - May 29, 2020
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021
View More Upcoming Conferences →
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Toulouse, France Apr 24, 2019 - Apr 26, 2019 Abstract Submission Date: Nov 17, 2018
2019 IEEE Holm Conference on Electrical Contracts Milwaukee, WI USA Sep 14, 2019 - Sep 18, 2019 Abstract Submission Date: Feb 8, 2019
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) Pisa, Italy Sep 16, 2019 - Sep 19, 2019 Abstract Submission Date: Jan 15, 2019
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IEEE Electronics Packaging Award

 Bill Screen Shot Image 2

Recipient of 2018

IEEE Electronics Packaging Award

William Chen

         Fellow of ASE Group, Sunnyvale, California, USA 

“For contributions to electronic packaging from research and development through industrialization, and for his leadership in strategic roadmapping efforts.”
 
 

IEEE CPMT Symposium Japan 2018

November 19 - 21 2018
Kyoto, Japan


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