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Higurashi Bio

Higurashi

Eiji Higurashi (M’10-SM’17) received the M.E. and Ph.D. degrees from Tohoku University, Sendai, Japan, in 1991 and 1999, respectively. From 1991 to 2003, he was with Nippon Telegraph and Telephone Corporation (NTT), Japan. From 2003 to 2017, he was an Associate Professor with The University of Tokyo, Japan. From 2017 to 2022, he was a team leader or a group leader with The National Institute of Advanced Industrial Science and Technology (AIST). Since 2022, he has been a Professor in the Department of Electronic Engineering, School of Engineering, Tohoku University.

He is a Senior Member of the Institute of Electrical and Electronics Engineers (IEEE), the Institute of Electrical Engineers of Japan (IEEJ), and the Institute of Electronics, Information, and Communication Engineers (IEICE). He is a member of the Japan Institute of Electronics Packaging (JIEP), the Japan Society for Precision Engineering (JSPE), the Japan Society of Applied Physics (JSAP). He is an active member of the IEEE EPS Japan Chapter and served as the Secretary from 2013 to 2014, the Vice Chair from 2019 to 2020, and the Chair from 2021 to 2022. He has served as the General Chair of International Conference on Electronics Packaging (ICEP) from 2020 to 2021. He served as the Editor-in-Chief of Editorial Committee of the Journal of The Japan Institute of Electronics Packaging and has served as an Editor-in-Chief of Editorial Committee of the Transactions of The Japan Institute of Electronics Packaging.

He has authored or co-authored more than 300 journal and conference papers. He was a recipient of the Igarashi Award from the Sensors and Micromachine Subsociety of the Institute of Electrical Engineers of Japan in 2002, the Okawa Publications Prize from the Okawa Foundation for Information and Telecommunications in 2003, the Ichimura Academic Award from the New Technology Development Foundation in 2008, the International Conference on Electronics Packaging Best Paper Award in 2013 and 2016, 18th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2015) Outstanding Paper Award in 2015.