Jain Bio

Dr. Aakrati Jain (M’21) is a Hardware Engineer at IBM Research's AI Hardware Center in Albany, NY. Her work has a strong focus on advanced packaging for Heterogeneous Integration in high-computational applications like AI and Machine Learning. Dr. Jain holds a B. Tech. degree in Mechanical Engineering (2013) from Indian Institute of Technology Kharagpur, India, and a direct Ph.D. in Mechanical Engineering (2019) with a specialization in heat transfer and electronics cooling from Purdue University in West Lafayette, Indiana. Since joining IBM Research in January 2020, Dr. Jain has been actively involved in various aspects of packaging, particularly in heat transfer, cooling, and thermal characterization of electronic packages for high-bandwidth applications. Her research endeavors revolve around understanding the factors influencing the thermal performance of electronic packages, aiming to enhance their efficiency and reliability. 

In addition to her role as a Hardware Engineer, Dr. Jain holds the position of Lead of Operations for IBM's Chiplet Packaging Lab. She is responsible for enabling bond and assembly processes, and her expertise lies in laser-based wafer separation techniques. Dr. Jain also serves as the technical lead in IBM's joint development endeavors with their dicing technical partner. In this role, she spearheads the definition and strategic direction of wafer separation processes for IBM Research's advanced packaging initiatives.

Throughout her career, Dr. Jain has actively contributed to the field of electronics cooling and packaging. Her research has been published in renowned journals and presented at international conferences such as IJHMT, IEEE ECTC, and ITherm. She has authored more than 15 peer-reviewed articles and filed multiple technical patents, showcasing her innovative thinking and contributions to the industry.

Outside of her research, Dr. Jain actively participates in professional organizations and community initiatives. She currently serves as the Secretary for IEEE EPS's newly-formed Mid-Hudson Valley (MHV) chapter. Under her leadership, the chapter has successfully organized two well-attended Mini-Colloquiums, featuring industry experts who shared insights on relevant topics in electronics packaging. Under her tenure, the chapter also organized a lecture series and a virtual seminar. Additionally, she serves as an industry liaison for the Semiconductors Research Center (SRC), where she mentors students and selects research projects in the packaging domain, with a specific focus on materials and technologies for thermal management and cooling of advanced packages.