Bio Przemek Gromoala

PRZEMYSLAW GROMALA (M ’14, SM ‘20) is a senior simulation expert at Robert Bosch GmbH, Automotive Electronics in Reutlingen, Germany. He currently leads an international simulation team and an FEM validation and verification laboratory, focusing on the implementation of simulation design of electronic control modules and multi-chip power systems for hybrid drives. His technical expertise includes materials characterization and modeling, multi-domain and multi-scale simulation including fracture mechanics, V&V techniques, and prognostics and health management of safety-relevant electronic control systems. Established an extensive international network within Robert Bosch GmbH (AE and other business units) and between top universities (TU Delft, TU Chemnitz, University of Maryland, Auburn University, IISC Bangalore) and R&D institutes (FhG ENAS, IMEC, RE.SE) in Europe and worldwide (USA, China, India). He established direct contacts between Bosch and semiconductor industry leaders: e.g., Intel, Xilinx. Infineon, On-Semi.

Before joining Bosch, Mr. Gromala worked at Delphi (now Aptiv), at the European Development Center in Krakow, Poland, and at the Infineon R&D Center in Dresden, Germany.

He holds a PhD in mechanical engineering from the Cracow University of Technology.

Przemyslaw Gromala is an active member of IEEE EPS conference committees:

- ECTC (TMSC co-chair 2017/18, TMSC chair 2018/19 and 19/20),

- EuroSimE (since 2016, various roles),

- REPP symposium - committee member and European liaison (2020 and 2021)

- iTherm (Mechanics and Reliability co-chair 2019 and 2020, Mechanics and Reliability track chair 2021 and 2022, Panel co-chair 2021 and 2022)

- ASME: InterPACK (Automotive tract co-chair 2017, Automotive track chair 2018, -19, technical program co-chair 2020, technical program chair 2021, General conference chair 2022).

- He is a chair of the IEEE EPS TWG Reliability since 2022, before he was a co-chair for 2 years.

Przemyslaw Gromala contributes to the IEEE EPS community by presenting his work at many conferences and professional development courses (EuroSimE, ECTC/iTherm). He has served/organized panels at many of these events (IEEE iTherm, ECTC, EuroSimE), on a variety of topics including materials characterization, numerical modeling, and prognostics and health management of electronics used in harsh environments.

He actively contributes to the IEEE EPS Heterogenous Integration Roadmap in three chapters:

- Automotive

- Simulation and Co-Design

- Reliability (as of 2021)

In addition to his IEEE activities, he is a member of the EPoSS (Chair of the EPoSS ID 2019 document, Quality, Reliability and Safety chapter) and ECS (Chair of the ECS SRIA 2020 chapter, Quality, Reliability, Security and Cyber Security chapter) committees - defining R&D and innovation needs as well as policy requirements related to the integration of smart systems and integrated micro- and nanosystems in Europe.

Przemyslaw Gromala is author and co-author of more than 50 papers in journals and conferences and two book chapters.