Bio Teng

 

ANNETTE TENG (SM: 2001)is the Chief Technology Officer at Promex Industries, a manufacturer of electronic and medical components in Silicon Valley, since 2014.  She has spent most of her career in electronic component packaging and manufacturing in both corporate and academic environments.  Born in Borneo (Malaysia), she left at 16 to attend Sweet Briar College in Virginia.  After Graduating from University of Virginia with a Ph.D. in Materials Science, she moved to Silicon Valley and started her career in the IC world at Signetics.  She has worked in components packaging and assembly at Philips Semiconductor, Linear Technology Corp. and Corwil Technology.  Prior to joining Promex, she was Package Assembly Manager at Silanna in Australia for 3 years.   She also worked at Hong Kong University of Science and Technology and helped launch their electronics packaging programs from 1997 to 2000.  She has published at ECTC and Meptec in the area of dicing, die attach films and package delamination.  She has been active in IEEE-EPS Chapter activities in Silicon Valley since 2000 and is currently the Chair of the IEEE-EPS Santa Clara Chapter.