Co-Packaged Optics Integration for Hyperscale Networking
Sandeep Razdan1 , Matt Traverso, and Anthony Torza, Cisco Systems, Inc.
1 Senior Member IEEE
Abstract
Co-packaged Optics (CPO) is an emerging technology that integrates high bandwidth optical engines next to a compute chip on the same substrate. The technology’s key advantage lies in the ability to provide high bandwidth [1, 10] and lower latency [18] while reducing overall system power consumption compared to traditional pluggable optical transceivers [1]. By leveraging silicon photonicsbased optical engines, CPO achieves high level of optical and electrical device integration, using proven semiconductor fabrication technologies and design processes, thereby achieving scale, reliability, and cost reduction. However, critical challenges in assembly, optical coupling, mechanical and thermal design must be addressed to ensure reliable and scalable manufacturing. Demonstrating long term reliability, serviceability and interoperability are critical to wide scale adoption and deployment of CPO in hyperscale networks and high-performance computing applications.