Expanding Packaging Technologies into Antenna Technology

Kexin Hu1, Yepu Cui1, Yueping Zhang2, and Manos. M. Tentzeris1

Georgia Institute of Technology, USA1

Nanyang Technological University, Singapore2

Since the mid-1990s, complementary metal oxide semiconductor has been the technology driver for the wireless revolution. It is in fact now the dominant technology for the fifth generation (5G) New Radio (NR).

AiP technology integrates an antenna (or antennas) with a radio chip (or chips) in a package [1, 2]. It balances performance, size, and cost well. Hence, it has been the antenna and packaging technology for millimetre-wave (mmWave) 5G NR.

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