The EPS proudly congratulates the inaugural recipents of the IEEE Certificate of Distinguished Achievement for Technical Leadership and Expertise:

Chong Leong Gan 

Scott Clary

The 9th Electronics System-Integration Technology Conference (ESTC) will be taking place in Sibiu, Romania September 13 - 16, 2022.

The deadline for submission of abstracts has been extended to March 1, 2022.

The ESTC 2022 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results. 

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The Santa Clara Valley EPS chapter invites members and guests to join them for one or more of their upcoming WebEx webinars.

Topics include:

-- On-Shoring the Next Generation of Advanced Packaging

-- Data Centers At Meta: Heterogenous Integration Driven By AI/ML And Network Applications 

-- To Chiplet or Not To Chiplet: Heterogeneous Integration and Chiplets

-- Understanding your Supply Chain: What is Hiding There

-- Delivering Reliable Systems: Automotive and Mobile Electronics

 For more information, or to join our Dlist, visit

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Date: May 31 – June 3, 2022

Location:  The Sheraton San Diego Hotel and Marina

     1380 Harbor Island Drive

                 San Diego, CA 92101



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Date: 24 Feb 2022

Time: 10:15 AM to 06:30 PM (All times are Europe/Zurich)

Location: microPark Pilatus (C/O CSEM SA)

    Industriestrasse 23

    Alpnach Dorf, Switzerland

    Switzerland 6055

 During this workshop, which will be conducted as a joint event between IEEE EPS chapter Switzerland, Swiss photonics and CSEM, we will take a deeper look at precision assembly solutions from the industry and from development partners. Whether it be an active or a passive assembly of photonics components, it requires in many cases precision alignment of e.g., lasers, waveguides, detectors and lenses.

For more information and to Register