Abstract— The rapid adoption of 5G mobile networking technology means that packaged ICs have new features and capabilities that present significant test challenges. IC package test requires quick adaptations to address these new test challenges. In this paper we discuss some of the key areas that need innovation to address these test challenges as volume of 5G IC’s rapidly scale. This increases the demand for the development of low cost and scalable high-volume manufacturing test solutions. We discuss the challenges in OTA test, tooling and interconnects, and RF test instruments.
Keywords—5G, mmWave, package test, OTA, RF, Test Instruments, DFT, near field, modulation, sockets, interconnects
As we shift into the new decade, the world is quickly becoming more connected and 5G proliferation is playing a key role. Many aspects and industries are embracing the value of 5G including automotive, health care, the cloud, and creating opportunities for smart homes and cities . 5G enabled IC’s are at the center of this evolving infrastructure.