3D PEIM Conference Update
3D PEIM Conference Reveals the Five “M”s in Power Electronics
Multiscale, Multiphysics, Modeling, Materials and Manufacturing
M Raj Pulugurtha (Florida International University), Brian Narveson (Narveson Innovative Consulting),
John Bultitude (KEMET, A Yageo Company) and Vanessa Smet (Georgia Institute of Technology)
The 3D Power Electronics Integration and Manufacturing (3D PEIM 2023) conference highlighted the need for multiscale multiphysics modeling to design for advanced topologies and architectures, coupled with innovations in materials and manufacturing to reliability for emerging computing, communication and automotive markets. This article points to selected key fundamental technology take-home lessons from the 3D PEIM conference held in FIU, Miami in February 2023.
The 3D Power Electronics Integration and Manufacturing Symposium, chaired by Markondeya Raj Pulugurtha, FIU was held from February 1-3, 2023 and hosted by Florida International University (FIU), in Miami, Florida. The Symposium is financially sponsored by Power Source and Manufacturing Association (PSMA) and technically sponsored by the IEEE Electronic Packaging Society (EPS) and Florida International University. The sponsor Chair, Devarajan Balaraman (Wolfspeed) engaged with seven Partner/Exhibitors: Amkor Technology, FIU Biomedical Engineering, KEMET a YAGEO Company, Wolfspeed, Indium Corp and Carbice, who also contributed to the success of the event. The workshop technical program was led by technical co-Chairman John Bultitude, KEMET, A Yageo Company, and Vanessa Smet, Georgia Tech. The Symposium focused on multiscale power electronics and addressing its key challenges through Multiphysics modeling coupled with emerging topologies and architectures, materials, integration and manufacturing to create state of the are power systems