Digital Twins for Electronics Packaging and Systems
Przemyslaw Gromala 1, Adwait Inamdar 2, Willem van Driel 2, GuoQi Zhang 2, Christopher Bailey 3, Luu Nguyen 4, Benson Chan 5, Jong Eun Ryu 6, Farnood Rezaie 7, Abram Detosky 8
1 Robert Bosch GmbH, Reutlingen, Germany; 2 Delft University of Technology, Delft, Netherlands; 3 Arizona State University, Tempe, Arizona, USA; 4 PsiQuantum, Palo Alto, California, USA; 5 Binghamton University, New York, USA; 6 North Carolina State University, Raleigh, NC, USA; 7 Cisco Systems Inc., San Jose, California, USA; 8 Intel Corporation, Hillsboro, Oregon, USA
1. INTRODUCTION
Digital Twins (DT) have become a groundbreaking concept in the field of electronics packaging and electronic systems. In an era characterized by rapid technological advances and increasing complexity in electronics packaging products, digital twins offer a revolutionary approach.
These virtual replicas of physical semiconductor circuits, electronic devices, or systems provide engineers and researchers with invaluable information, enabling real-time monitoring, analysis and optimization. This innovative technology not only improves product development and performance, but also significantly streamlines design and manufacturing processes, ultimately pushing the boundaries of what is possible in the world of electronics packaging and electronics enabled systems.
However, it’s worth noting that the concept of digital twins can sometimes vary depending on the context, application field, and one’s expertise or experience. In this article, we aim to explore the diverse applications of digital twins in the electronics industry, starting with an examination of various existing definitions.