Upcoming Webinar from the EPS Nanotechnology Technical Committee
Title: Nanopackaging for AI and power delivery
Date: December 13, 2023
Time: 11AM EST (8AM PST)
Speakers: Dr. Siddharth Ravichandran and Prof. Kuan-Neng Chen
Moderator: Dr. Srikrishna Sitaraman
Abstract: The proliferation of artificial intelligence (AI) applications has increased the demand for compute performance and memory capacity. This is happening at a time when the semiconductor industry is facing challenges associated with the slowing down of Moore's Law. Chiplet integration using nanopackaging is being viewed as a critical enabling technology for supporting AI applications. Such highly integrated systems require a multitude of materials to support electrical, mechanical, thermal, and chemical properties. In addition, these materials need to be compatible with packaging processes to ensure compatibility with low-cost manufacturing solutions.